FR4 epoxy glass fiber board alias: glass fiber heat insulation board, glass fiber board (FR-4), glass fiber composite board, etc., composed of glass fiber materials and high heat resistance composite materials, and does not contain asbestos harmful to the human body. It has high mechanical properties and dielectric properties, good heat resistance and moisture resistance, and good processability.

FR4 epoxy glass fiber board can give full play to its mechanical properties under medium temperature; under high temperature environment, it can give full play to its electrical properties. Therefore, due to these characteristics, epoxy board is very suitable for high-insulation structural parts in the electrical and electronic fields. It has higher mechanical strength and resistance to voltage breakdown than the national standard 3240 board. The main steps of FR4 epoxy glass fiber board include heating, pressing, curing, cooling, demoulding, etc. The lamination process includes 4 steps:

1. Preheating stage: Place the epoxy board in a hot press and heat it for 30 minutes at a temperature of about 1200C to fully integrate the epoxy resin and the reinforcing material, and at the same time cause the volatiles to overflow. This step is very critical. If the time is too short and the temperature is not enough, bubbles are likely to be generated. If the temperature is too high and the time is too long, the blank will slip out.

2. Hot-press forming stage: In this stage, temperature, time, and pressure will have a direct impact on the final product, and these factors must be constantly changing according to different materials. For example, the temperature of epoxy phenolic laminated cloth is set at about 17CTC, and the temperature of epoxy silicone glass cloth is set at about 20°C. If the board is thin, the hot pressing temperature should be lowered.

3. Cooling and demoulding: After pressing, put the epoxy board into cold water to cool down, the time is between half an hour and one hour. During this period, attention should be paid to the change of internal stress. Excessive thermal expansion and contraction will cause the laminated board to warp and deform.

4. Post-treatment: This step is to make the performance of the epoxy board more superior. For example, putting the produced board in an oven for heat treatment, which can eliminate internal stress residue.