Laser cutting refers to the use of high-power density laser beam to irradiate the material to be cut, so that the material is quickly heated to the vaporization temperature, evaporation forms a hole, and transfers through the movement of the material, the hole continuously forms a very narrow width (such as about 0.1mm) Sewing to complete the cutting of the material. Wire cutting refers to a processing method that uses moving metal wires (molybdenum wire, copper wire, or alloy wire) as electrode wires to cut out parts.

What’s the difference of them?

1.Principle

1). Laser cutting: the focused high power density laser beam is used to irradiate the workpiece, so that the irradiated material quickly melts, vaporizes, ablate or reaches the ignition point, and at the same time, the molten material is blown off by the high-speed air flow coaxial with the beam, thereby achieving The workpiece is cut open.

2). Wire cutting: Rely on the pulse electric discharge between the electrode wire and the workpiece, which produces high temperature to melt or vaporize the metal.

2.Feature

1). Laser cutting: after laser cutting, the width of the heat affected zone is very small, the performance of the material near the slit is almost not affected, and the workpiece deformation is small, the cutting precision is high, the geometry of the slit is good, and the slit cross section, the shape is a regular rectangle.

2). Wire cutting: directly use 0.03-0.35 mm metal wire as the electrode, no specific shape is needed, which can save the design and manufacturing cost of the electrode; regardless of the hardness of the workpiece material, as long as it is a conductor or semiconductor material can be processed, and the electrode wire is worn Small, high processing accuracy; suitable for the processing of small batches, parts with complex shapes, single parts and trial products, and the processing cycle is short.

3.Application

1). Laser cutting: It is controlled by CNC program or made into a cutting robot. As a precise processing method, laser cutting can cut almost all materials, including two-dimensional cutting or three-dimensional cutting of thin metal plates.

2). Wire cutting: processing molds; processing parts with fine structure; processing parts with complex shapes; processing hard conductive materials; trial production of new products; cutting of precious metals