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What is FR4?
2020-02-16

FR4 is a kind of code of fire resistant material grade, represented by the mean resin material after combustion state must be able to put out a material specification, it is not a material name, but a level of material, so the general FR-4 grade materials used in the circuit board has a lot of kinds, but most are based on the so-called four functions (Tera - Function) of epoxy resin and Filler (Filler) and glass fiber made of composite materials.


NEMA,A material standard specified by the electrical manufacturers association of the United States. The corresponding IEC international electrical commission standard is EPGC202. There is no national equivalent.


Close to the China standard of 3240 epoxy laminated glass cloth board, the corresponding IEC international electrical engineering commission standard of 3240 is EPGC201, and EPGC201 and EPGC202 have only the difference in flame retardancy.Therefore, we can simply consider fr-4 to be an improved product of 3240 with enhanced flame retardancy.


FR4 epoxy board, the main material is imported semi-curing sheet, the color is white, yellow, green, room temperature 150℃ still has high mechanical strength, dry state, wet state electrical performance, flame retardant, used in electrical, electronic and other industries insulation structural parts, using imported raw materials, domestic press and standard process carefully manufactured;

The main specifications have 1000*2000 mm,1020mm*1220mm


FR4 epoxy plate application characteristics:

1. Various forms.A variety of resin, curing agent, modifier system can almost adapt to the application of the form requirements, the range of very low viscosity to high melting point solid.
2. Convenient curing.Using various curing agents, the epoxy resin system can be almost cured in the temperature range of 0~180℃.
3. Strong adhesion.The presence of polar hydroxyl groups and ether bonds in the molecular chains of epoxy resins makes them highly adhesive to various substances.Epoxy resin curing low shrinkage, resulting in a small internal stress, which also helps to improve the adhesion strength.
4. Low contractility.The reaction between the epoxy resin and the curing agent used is carried out by direct addition or ring-opening polymerization of the epoxy group in the resin molecule, with no water or other volatile by-products released.They exhibit very low shrinkage during curing (less than 2%) compared to unsaturated polyester and phenolic resins.
5. Mechanical properties.The cured epoxy resin system has excellent mechanical properties.
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