The development direction of epoxy resin electronic and electrical encapsulation and insulation materials is mainly to improve the heat resistance, dielectric and flame retardancy of the material, and reduce the water absorption, shrinkage and internal stress. The main ways of improvement are: synthesis of new epoxy resins and curing agents; high purity of raw materials; modification of epoxy resins, including toughening, softening, filling, reinforcement, blending, etc.; development of bromine-free flame retardant systems; Improve the molding process methods, equipment and technology. With the rapid development of semiconductor technology, the requirements for packaging materials are getting higher and higher, and ordinary epoxy resins can no longer fully meet the technical requirements.

At present, the improvement of epoxy resin technology is mainly focused on the development of low-viscosity or low-melt-viscosity difunctional epoxy resins. By filling high-content inorganic fillers, the internal stress of the packaged devices is greatly reduced, and the passivation cracking and wiring are reduced. Undesirable defects such as loosening and wire breakage; develop a multi-functional epoxy resin, and at the same time introduce a heat-resistant and moisture-resistant structure compound into the epoxy resin, so that the packaged device has both high heat resistance and low water absorption rate. Low internal stress.

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