FR4 epoxy glass fiber board is a kind of substrate with epoxy resin as adhesive and electronic grade glass fiber cloth as reinforcing material. Its bonding sheet and inner core thin copper clad laminate are important base materials for making multi-layer printed circuit boards.

Vertical Bending Strength A: Normal: E-1/150, 150±5℃≥340Mpa

Parallel layer impact strength (simply supported beam method): ≥230KJ/m

Insulation resistance after immersion in water (D-24/23): ≥5.0×108Ω

Vertical layer-wise electrical strength (in 90±2℃ transformer oil, plate thickness 1mm): ≥14.2MV/m

Parallel layer breakdown voltage (in 90±2℃ transformer oil): ≥40KV

Relative permittivity (50Hz): ≤5.5

Relative dielectric constant (1MHz): ≤5.5

Dielectric loss factor (50Hz): ≤0.04

Dielectric loss factor (1MHz): ≤0.04

Water absorption (D-24/23, plate thickness 1.6mm): ≤19mg

Density: 1.70-1.90g/cm³

Flammability: F V0

The mechanical properties, dimensional stability, impact resistance and moisture resistance of epoxy glass fiber cloth substrates are higher than those of paper substrates. It has excellent electrical performance, high operating temperature, and its performance is less affected by the environment. In terms of processing technology, it has great advantages over other resin glass fiber cloth substrates.